bmcpherron_resume
Nikon s-205 tool owner for multiple Intel technologies. Duties include daily sustaining support and process control of Nikon scanners. Troubleshooting and problem resolution of Scanner issues, which also includes running resolution meetings for tools down over 24 hours. Process improvement activities such as Final White Paper author and implementation of accepted process improvement projects. Managed and chaired multiple weekly Engineering meetings such as; Weekly Nikon Error Log Review, Daily Engineering Pass down , Cycle time improvement Task Force. Extensive data analysis experience using Excel, Crystal Ball, SQL Pathfinder, and JMP. Also frequently provided GL coverage when GL was out.
Motorola, Tempe AZ 2/2000 to 1/2006
Position: Senior Product Engineer
Employed in the Radio Products Division as a Product and Test Engineer with responsibilities over the MC13190FC 2.4GHz Data radio transceiver chip. Responsibilities include new product qualification and reliability testing using Teradyne Catalyst automated Test Equipment. Yield improvement and cost reduction activities are also a primary job function as well as coordinating manufacturing of products through both the Wafer Fabrication and Final Assembly manufacturing areas. Skills also include thorough knowledge of statistical methods and Design of Experiments (DOE) methods for process improvement. Green Belt Statistician certified.
Motorola, Mesa AZ 10/1997 to 2/2000
Position: Photolithography Process Engineer
Employed in the Bipolar Manufacturing Complex. Developing and maintaining the Stepper based photolithography processes for the manufacture of both bipolar and RF MOS processes. Worked extensively on transferring technologies from older scanning projection aligners to Ultratech 1X steppers. Also support Nikon 4 body and Nikon 6 body 5X stepper processes. Work experience also includes process development on SVG track coat and develop equipment, as well as extensive SPC and data analysis.
StorageTek, Louisville CO 1/1992 to 10/1997
Position: Development Engineer Photolithography.
Employed in the Thin Film Tape Head development group. Developing all positive photoresist lithography processes for new generation tape products. Project leader of a team consisting of 3 technicians and 5 operators. Significant achievements include; the start-up of a new larger substrate line, from specifying of equipment to process optimization for manufacturing. Develop process models for the photo area using DOE and other experimental design techniques. Extensive experience with photo process troubleshooting and problem solving. Team leader of corporation recognized yield improvement group which increased production yields by 5%. Set up initial SPC charts for manufacturing, assist in the implementation of specification limits based on process capabilities and variation (Cpk). Also specify and develop equipment/processes for the wet etch and critical measurement areas.
ARIZONA TEACHING CERTIFICATIONS
Secondary Education – Mathematics valid until 2021
Secondary Education – Chemistry valid until 2020
General Education – Science valid until 2020
Structured English Immersion – SEI Valid until 2020
Valid Arizona IVP – Fingerprint Card
EDUCATION
BS Chemistry, University of Colorado, Denver Colorado. GPA 3.4.
AAS Electronics Technology, Front Range Community College, Westminster Colorado. GPA 3.7.
PATENTS
Method of Wet Etching Aluminum Oxide to Minimize Undercutting - Patent number 5,876,614
StorageTek Trade Secret awarded for novel resist processing technique.
References available upon request.
Nikon s-205 tool owner for multiple Intel technologies. Duties include daily sustaining support and process control of Nikon scanners. Troubleshooting and problem resolution of Scanner issues, which also includes running resolution meetings for tools down over 24 hours. Process improvement activities such as Final White Paper author and implementation of accepted process improvement projects. Managed and chaired multiple weekly Engineering meetings such as; Weekly Nikon Error Log Review, Daily Engineering Pass down , Cycle time improvement Task Force. Extensive data analysis experience using Excel, Crystal Ball, SQL Pathfinder, and JMP. Also frequently provided GL coverage when GL was out.
Motorola, Tempe AZ 2/2000 to 1/2006
Position: Senior Product Engineer
Employed in the Radio Products Division as a Product and Test Engineer with responsibilities over the MC13190FC 2.4GHz Data radio transceiver chip. Responsibilities include new product qualification and reliability testing using Teradyne Catalyst automated Test Equipment. Yield improvement and cost reduction activities are also a primary job function as well as coordinating manufacturing of products through both the Wafer Fabrication and Final Assembly manufacturing areas. Skills also include thorough knowledge of statistical methods and Design of Experiments (DOE) methods for process improvement. Green Belt Statistician certified.
Motorola, Mesa AZ 10/1997 to 2/2000
Position: Photolithography Process Engineer
Employed in the Bipolar Manufacturing Complex. Developing and maintaining the Stepper based photolithography processes for the manufacture of both bipolar and RF MOS processes. Worked extensively on transferring technologies from older scanning projection aligners to Ultratech 1X steppers. Also support Nikon 4 body and Nikon 6 body 5X stepper processes. Work experience also includes process development on SVG track coat and develop equipment, as well as extensive SPC and data analysis.
StorageTek, Louisville CO 1/1992 to 10/1997
Position: Development Engineer Photolithography.
Employed in the Thin Film Tape Head development group. Developing all positive photoresist lithography processes for new generation tape products. Project leader of a team consisting of 3 technicians and 5 operators. Significant achievements include; the start-up of a new larger substrate line, from specifying of equipment to process optimization for manufacturing. Develop process models for the photo area using DOE and other experimental design techniques. Extensive experience with photo process troubleshooting and problem solving. Team leader of corporation recognized yield improvement group which increased production yields by 5%. Set up initial SPC charts for manufacturing, assist in the implementation of specification limits based on process capabilities and variation (Cpk). Also specify and develop equipment/processes for the wet etch and critical measurement areas.
ARIZONA TEACHING CERTIFICATIONS
Secondary Education – Mathematics valid until 2021
Secondary Education – Chemistry valid until 2020
General Education – Science valid until 2020
Structured English Immersion – SEI Valid until 2020
Valid Arizona IVP – Fingerprint Card
EDUCATION
BS Chemistry, University of Colorado, Denver Colorado. GPA 3.4.
AAS Electronics Technology, Front Range Community College, Westminster Colorado. GPA 3.7.
PATENTS
Method of Wet Etching Aluminum Oxide to Minimize Undercutting - Patent number 5,876,614
StorageTek Trade Secret awarded for novel resist processing technique.
References available upon request.